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 Ultra-Low Capacitance TVS for ESD and CDE Protection
PROTECTION PRODUCTS - RailClamp(R) Description
RailClamps are ultra low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClampTM1502B has a typical capacitance of only 0.60pF (pin 1 to 2). This means it can be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). Each device can be configured to protect 1 bidirectional line or two unidirectional lines. These devices are in a small SC-75 (SOT-523) package and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where board space is at a premium. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as Automatic Test Equipment and Infiniband circuits.
RClamp1502B
Features
Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Designed to replace polymer TVS Protects up to two I/O lines Ultra-Low capacitance (<1pF) No insertion loss to >3.0GHz Low profile (<1mm) Low leakage current and clamping voltage Low operating voltage: 15.0V Solid-state silicon-avalanche technology
Mechanical Characteristics
SC-75 (SOT-523) package Lead Finish: Matte Tin RoHS/WEEE Compliant Molding compound flammability rating: UL 94V-0 Marking: P6 Packaging: Tape and Reel
Applications
Automatic Test Equipment Firewire Ports GaAs Photodetector Protection HBT Power Amp Protection Infiniband Transceiver Protection
Dimensions
1.60 0.50 BSC
Schematic & PIN Configuration
3
1.60
0.80
1
1.00 BSC
2
0.75
Nominal Dimensions (mm)
Revision 2/3/2009 1
SC-75 3L (Top View)
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RClamp1502B
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) Peak Pulse Current (tp = 8/20s) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k IP P VESD TJ TSTG Value 200 5 15 8 -55 to +125 -55 to +150 Units Watts A kV C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Symbol VRWM V BR Conditions Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 It = 1mA Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 VRWM = 15V, T=25C Pin 1 or Pin 2 to Pin 3 and Between Pins 1 and 2 IPP = 1A, tp = 8/20s Pi n 1 to Pi n 2 IPP = 5A, tp = 8/20s Pin 1 or Pin 2 to Pin 3 IPP = 5A, tp = 8/20s Pi n 1 to Pi n 2 VR = 0V, f = 1MHz Pi n 1 to Pi n 2 VR = 0V, f = 1MHz Pin 1 or Pin 2 to Pin 3 0.60 16.7 Minimum Typical Maximum 15 Units V V
Reverse Leakage Current
IR
1
A
Clamping Voltage Clamping Voltage Clamping Voltage
VC VC VC
32 36 40 0.9 1.5
V V V pF pF
Junction Capacitance Junction Capacitance
Cj Cj
(c) 2009 Semtech Corp.
2
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RClamp1502B
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10 Peak Pulse Power - PPk (kW)
Power Derating Curve
110 100 % of Rated Power or PP I 90 80 70 60 50 40 30 20 10
1
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC)
Clamping Voltage vs. Peak Pulse Current Pin 1 or Pin 2 to Pin 3
36 34
Clamping Voltage - VC (V)
Clamping Voltage vs. Peak Pulse Current Pin 1 to Pin 2
40 38 36 34 32 30 28 26 24 Waveform Parameters: tr = 8s td = 20s 0 1 2 3 4 5 6
Clamping Voltage - VC (V)
32 30 28 26 24 0 1 2 3 4 5 6 Peak Pulse Current - IPP (A)
Waveform Parameters: tr = 8s td = 20s
Peak Pulse Current - IPP (A)
Normalized Capacitance vs. Reverse Voltage Pin 1 or Pin 2 to Pin 3
1.5 Normalized Capacitance - Cj (pF) Line to Ground Capacitance 1.2 Normalized Capacitance - Cj (pF) 1 0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 Reverse Voltage - VR (V) 12 14
Junction Capacitance vs. Reverse Voltage Pin 1 to Pin 2
Line to Line Capacitance
1
f = 1 MHz 0.5 0 5 10 Reverse Voltage - VR (V)
f = 1 MHz 15
(c) 2009 Semtech Corp.
3
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RClamp1502B
PROTECTION PRODUCTS Typical Characteristics
Insertion Loss S21 (Pin 1 to Pin 2)
CH1 S21 LOG 6 dB / REF 0 dB 1: .03430 dB 900 MHz 2: .07870 dB 1.8 GHz 3: .28040 dB 2.5 GHz 0 dB
1 2 1 2
Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3)
CH1 S21 LOG 6 dB / REF 0 dB 1: .00460 dB 900 MHz 2: .02010 dB 1.8 GHz 3: -.08180 dB 2.5 GHz
3
3
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz
-6 dB -12 dB -18 dB -24 dB -30 dB -36 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz
ESD Response (4kV Contact per IEC 61000-4-2)
ESD Response (8kV Contact per IEC 61000-4-2)
Analog Crosstalk
CH1 S21 LOG 20 dB /REF 0 dB
START. 030 MHz
. STOP 3000 000000 MHz
(c) 2009 Semtech Corp.
4
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RClamp1502B
PROTECTION PRODUCTS Applications Information
Device Connection Options This device is optimized for protection of 1 line operating in excess of 3GHz. It may also be used to protect two lines, but it is recommended it not be used much beyond 1GHz due to cross talk limitations. The device is connected as follows: One data line can be connected to either pin 1 or pin 2 with the other connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. Protection of two lines is achieved by connecting data lines at pins 1 & 2. Pin 3 is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Figure 1. Pin Configuration
(c) 2009 Semtech Corp.
5
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RClamp1502B
PROTECTION PRODUCTS Applications Information - Spice Model
RClamp1502B Spice Model
Table 1 - R Clamp1502B Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit A mp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 1.23E-14 21.8 0.72 2.801 1.0E-3 1.3E-12 2.541E-9 0.033 1.1 1.11 D2 (T VS) 1.23E-14 21.8 0.72 2.801 1.0E-3 1.3E-12 2.541E-9 0.033 1.1 1.11
(c) 2009 Semtech Corp.
6
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RClamp1502B
PROTECTION PRODUCTS Outline Drawing -SC-75 (SOT-523)
A
D e1 3 E
B
A A1 A2 b c D E E1 e e1 L L1 N 0 aaa bbb
DIM
DIMENSIONS MILLIMETERS MIN NOM MAX
0.60 0.00 0.60 0.15 0.10 1.50 1.45 0.75 0.90 0.10 0.75 0.80 0.30 0.20 1.60 1.70 1.60 1.75 0.80 0.85 1.00 BSC 0.50 BSC 0.10 0.22 0.30 (0.40) 3 0 8 0.10 0.20
E1
1
2 bxN e bbb CAB
A
A2
aaa C SEATING PLANE
A1
C
H GAUGE PLANE 0.25 L c
SEE DETAIL A
01 (L1) DETAIL A
SIDE VIEW
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -BTO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
Land Pattern -SC-75 (SOT-523)
X
Y C
DIM
C P p1 G X Y Z
DIMENSIONS INCHES MILLIMETERS
(.055) .039 .020 .024 .016 .031 .087 (1.40) 1.00 0.50 0.60 0.40 0.80 2.20
Z
G
Y
p1 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
(c) 2009 Semtech Corp.
7
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RClamp1502B
PROTECTION PRODUCTS Marking Ordering Information
Part Number RClamp 1502B.TCT Qty per Reel 3,000 Reel Size 7 Inch
P6
Tape and Reel Specification
RailClamp and RClamp are registered marks of Semtech Corporation
Device Orientation in Tape
A0 1.850.05mm
B0 1.850.05mm
K0 0.880.05mm
Tap e Width
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1 ( M IN )
E 1.750.10 mm (.069.004)
F
K (MAX)
P 4.00.1 mm (.157.004)
P0 4.00.1 mm (.157.004)
P2
T(MAX)
W
8 mm
4.2 mm (.165)
1.0 mm (.039)
3.50.05 mm (.138.002)
2.4 mm (.094)
2.00.05mm (.079.002)
0.4 mm (.016)
8.3 mm (.312.012)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
(c) 2009 Semtech Corp. 8 www.semtech.com


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